Description
SOT223 plastic surface-mounted package with increased heatsink; 4 leads. 8 February 2016. Package information. 1. Package summary. Terminal position SOT-223 . 1. 2. 2. 3. Table 1. Device summary. Order code. Marking. Package. Packaging. STN4NF03L. 4NF03L. SOT-223 . Tape & reel www.st.com SOT-223 Power MOSFET achieves junction-to-case thermal resistance R JC of 12oC/W. 2. Theory. When a device operates in a system under the steady-state Mar 6, 2017 Weight: 0.112 grams (Approximate). Package View. Package Outline Dimensions . SOT223 . SOT223 . Dim Min Max Typ. A. 1.55 1.65 1.60. A1. SOT-223 Case. Mechanical Drawing. Mounting Pad Geometry (Dimensions in mm). Lead Code: Reference individual device datasheet. Part Marking: Full Part
Part Number | SOT223 |
Brand | Motorola |
Image |
SOT223
MOTOROLA/
55191
1.66
IC Chip Co., Ltd.
SOT223
MOTOLORA
1089
2.86
Xian Neng Technology (Hongkong) International Limited
SOT223
MOTOLOLA
2547
4.06
Agreat Technology (Hong Kong) Co., Limited
SOT223
MOTORLA
2547
5.26
ENSPIRE TECHNOLOGY (HONG KONG) CO., LIMITED
SOT223 MSD602-RT1
MOTROLA
12000
6.46
N&S Electronic Co., Limited