Motorola

Description

Datasheet 1036 psi. 7.1 MPa . 1120 psi. 7.7 MPa . 1140 psi. 7.9 MPa . 940 psi. 6.5 MPa . G. Scotch-Weld AF 32/3M Scotch-Weld Structural Adhesive Primer EC-1660 Conductivity. 23-25% IACS. Thermal Expansion (20 C). 3.3 x 10-6 / F (6 x 10-6 / C). Fatigue Resistance (Endurance). > 10 million cycles at 100 ksi. (690 MPa ). Mar 21, 2007 Wafer addendum. 3.6 Reference die definition (SECS II Wafer map format) . 1036 m. (10) TEST bump edge to chip edge, y-length: 190 m. Test Results (Typical Averages). Cure Cycle A. Cure Cycle A. Cure Cycle B. Test Temperature. AF 3028. AF 3028FR. AF 3028. F. ( C) psi. ( MPa ) psi. ( MPa ) psi. 11.5 Memory map and register definition. .. 13.2 Reset memory map and register descriptions .. .317.